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| www..com 1N5819U Aerospace 45 V power Schottky rectifier Features A K K Aerospace applications Surface mount hermetic package High thermal conductivity materials Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop Package weight: 0.18 g Target radiation qualification - 150 krad (Si) low dose rate - 3 Mrad (Si) high dose rate Under ESCC qualification A LCC2B Description This power Schottky rectifier is designed and packaged to comply with the ESCC5000 specification for aerospace products. It is housed in a surface mount hermetically sealed LCC2B package. The 1N5819U is suitable for switching mode power supplies and high frequency DC to DC converters such as low voltage high frequency inverter, free wheeling or polarity protection. Table 1. Order code 1N5819UB1 Device summary(1) ESCC detailed specification 5103/028/04 5103/028/05 Quality level Engineering model Flight part Flight part Lead finish Gold plated Gold plated Solder dip EPPL Y Y 1A 45 V 150 C 0.45 V IF(AV) VRRM Tj(max) VF (max) 1N5819U01B 1N5819U02B 1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions. August 2009 Doc ID 16006 Rev 1 1/7 www.st.com 7 www..com Characteristics 1N5819U 1 Characteristics Table 2. Symbol VRRM IF(RMS) IF(AV) IFSM Tstg Tj Tsol 1. Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage Forward rms current Average forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Maximum soldering temperature (2) (1) Value 45 10 Tc = 135 C = 0.5 tp = 10 ms sinusoidal 1 25 -65 to + 150 150 245 Unit V A A A C C C dPtot 1 _________ < __________ Rth(j-a) dTj condition to avoid runaway for a diode on its own heatsink 2. Maximum duration 5 s. The same package must not be resoldered until 3 minutes have elapsed. Table 3. Symbol Rth(j-c) Thermal resistances Parameter Junction to case Value 16 Unit C/W 2/7 Doc ID 16006 Rev 1 www..com 1N5819U Characteristics Table 4. Symbol Static electrical characteristics Parameter Test conditions Tj = 25 C Tj = 100 C Tj = -55 C Tj = -55 C VR = 45 V VR = 45 V VR = 40 V VR = 40 V VR = 35 V VR = 24 V VR = 12 V VR = 6 V IF = 0.1 A Min. IF = 1A IF = 3.1 A Typ. Max. 20 3.5 20 10 15 3 2.5 1.6 1.2 1 350 490 450 650 800 mV mA A Unit A mA IR(1) Reverse leakage current Tj = 25 C Tj = 100 C Tj = 100 C Tj = 100 C Tj = 100 C Tj = 100 C Tj = 25 C Tj = 25 C VF(2) Forward voltage drop Tj = 100 C Tj = - 55 C Tj = 25 C 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 680 s, < 2% To evaluate the conduction losses use the following equation: P = 0.285 x IF(AV) + 0.165 IF2(RMS) Table 5. Symbol Dynamic characteristics Parameter Diode capacitance Test conditions VR = 5 V, F = 1 MHz Min. Typ. Max. 70 Unit pF Cj Figure 1. PF(AV)(W) Average forward power dissipation Figure 2. versus average forward current 1.2 Average forward current versus ambient temperature ( = 0.5) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 IF(AV)(A) Rth(j-a) = Rth(j-c) = 0.05 = 0.1 = 0.2 = 0.5 =1 1.0 0.8 0.6 0.4 T =tp / T tp T =tp / T tp 0.2 0.1 0.0 0.0 0.2 0.4 06 0.8 1.0 1.2 IF(AV)(A) 1.4 1.6 0.0 Tamb(C) 0 25 50 75 100 125 150 Doc ID 16006 Rev 1 3/7 www..com Characteristics 1N5819U Figure 3. Non repetitive surge peak forward current versus overload duration (maximum values) Figure 4. Relative variation of thermal impedance junction to case versus pulse duration IM(A) 16 14 12 10 8 6 4 IM 1.0 0.9 0.8 0.7 TC = 25 C TC = 75 C Zth(j-c) / Rth(j-c) 0.6 0.5 0.4 0.3 0.2 Single pulse TC = 125 C = 0.5 t 2 0 1.E-03 t(s) 1.E-02 1.E-01 1.E+00 0.1 0.0 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 tp(s) 1.E+01 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) TJ = 150 C Figure 6. Forward voltage drop versus forward current (typical values) 1.E+02 1.E+01 IR(mA) 10.00 IFM(A) TJ = 125 C 1.E+00 TJ = 100 C TJ = 75 C TJ = 50 C 1.00 TJ = 100 C 1.E-01 1.E-02 TJ = 25 C 0.10 TJ = 25 C 1.E-03 1.E-04 0.0 VR(V) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.01 0.0 0.1 0.2 0.3 TJ = 55 C VFM(V) 0.7 0.8 0.9 1.0 1.1 1.2 0.4 0.5 0.6 Figure 7. Non repetitive surge peak forward current versus number of cycles IFSM(A) 30 25 20 15 10 5 0 0 Number of cycles 10 100 1000 F = 50 Hz Tj initial = 25 C 4/7 Doc ID 16006 Rev 1 www..com 1N5819U Package Information 2 Package Information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 6. Leadless chip carrier 2 (LCC2B) package dimensions Dimensions Ref. A B D Note 1 Millimeters Min. Typ. 2.23 5.40 3.62 1.90 1.4 3.32 1.82 0.15 0.15 0.20 Max. 2.42 5.60 3.76 2.09 0.71 Min. Inches Typ. Max. A(1) B 2 C 1 2.04 5.27 3.49 1.71 0.48 - 0.080 0.088 0.095 0.207 0.213 0.220 0.137 0.143 0.150 0.067 0.075 0.082 0.019 0.055 0.131 0.072 0.006 0.006 0.008 0.028 - C F Note 1 D E Pin 2 Cathode E Note 1 E Pin 1 Anode F G H 1 2 r1 G H I r1 r2 I r2 Note 1: The anode is identified by metallization in two top internal angles and the index mark. 1. Measurement prior to solder coating the mounting pads on bottom of package. Doc ID 16006 Rev 1 5/7 www..com Ordering Information 1N5819U 3 Ordering Information Table 7. Order code 1N5819UB1 1N5819U01B 1N5819U02B Ordering information(1) ESCC detailed specification 5103/028/04 5103/028/05 LCC2B Package Lead finish Gold plated Gold plated Solder dip Marking 19UB1 19U01B 19U02B EPPL Weight Y 0.18 g Y 0.18 g Waffle pack Packing 1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions. 4 Revision history Table 8. Date 10-Aug-2009 Document revision history Revision 1 First issue. Changes 6/7 Doc ID 16006 Rev 1 www..com 1N5819U Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 16006 Rev 1 7/7 |
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